Browse complete Printed, Organic & Flexible Electronics Forecasts, Players & Opportunities 2010-2020 Report


Browse all ID Techex Market Research Reports

This report provides the most comprehensive view of the topic, giving detailed ten year forecasts by device type. The market is analyzed by territory, printed vs non printed, rigid vs flexible, inorganic vs organic, cost of materials vs process cost and much more, with over 200 tables and figures. Activities of over 1000 leading companies are given.

EXECUTIVE SUMMARY AND CONCLUSIONS


1. INTRODUCTION

1.2. Twenty year forecasts of unusual breadth

1.3. Terminology and definitions

1.4. Scope for printed electronics and electrics

1.5. There is a bigger picture

1.6. Printed electronics products today

1.6.1. New technologies, more opportunity

1.6.2. With or without a silicon chip

1.6.3. Highest volume products with no silicon chip

1.6.4. Printed electronics with silicon chips

1.6.5. Electronic apparel

1.6.6. Display and lighting

1.6.7. Photovoltaic power by the mile

1.6.8. Stretchable electronic products for sale

1.6.9. A view from Toppan Forms

1.7. Displays are the main sector for now

1.8. Photovoltaics beyond conventional silicon are the second largest market

1.9. How printed electronics is being applied

1.10. Surprisingly poor progress with low cost electronics so far

1.11. Threat - silicon chips keep getting cheaper

1.12. Printed electronics for smart packaging

1.13. Driving forces for disposable electronics

1.14. Balance of reporting on printed and organic electronics

1.15. Inorganic patterning shows the way

1.16. Great uncertainty

1.17. Challenging conventional electronics

1.18. Flexible is a Big Market

1.19. Assumptions for our forecasts

1.20. Despite recession, finance for printed electronics is not drying up
2. LOGIC AND MEMORY

2.1. Logic and Memory Market Forecasts 2010-2020

2.1.1. Logic and memory forecasts 2010-2020

2.2. Impact on silicon

2.3. Transistor design

2.3.2. New TFT geometry

2.3.3. Advantages of printed and thin film transistors and memory vs traditional silicon

2.3.4. The main options for the printed semiconductor

2.3.5. Benefits and applications envisaged for TFTCs in general

2.3.6. Development path

2.3.7. Obtaining higher frequency performance

2.3.8. Shakeout of organic transistor developers

2.3.9. Breakthrough in printed inorganic performance in from Kovio

2.3.10. NanoGram

2.3.11. Progress towards p-type metal oxide semiconductors

2.3.12. Do organic transistors have a future?

2.3.13. 3D printed silicon transistors - Japan

2.3.14. Choice of printing technologies

2.3.15. Company strategy and value chain

2.4. Memory

2.5. Flexible Memristor

2.6. RFID

2.6.1. Market for RFID

2.6.2. Ultimate potential for highest volume RFID

2.6.3. Penetration of chipless/printed RFID
3. DISPLAYS

3.1. Market drivers

3.2. OLEDs as displays for electronic products

3.2.2. Developers of OLEDs

3.2.3. Mobile phones and OLEDs

3.2.4. Digital Cameras and OLEDs

3.2.5. Audio/Visual players and OLEDs

3.2.6. TV sets and OLEDs

3.2.7. OLED market forecasts 2010-2020

3.2.8. Impediments to OLED adoption

3.2.9. Unmet technical needs for OLEDs

3.3. Electrophoretic

3.3.2. Applications of E-paper displays

3.3.3. The Killer Application

3.3.4. Electrophoretic displays market forecasts 2010-2020

3.4. Electrochromic

3.4.2. Electrochromic displays market forecasts 2010-2020

3.5. AC Electroluminescent

3.5.1. Applications

3.5.2. Electroluminescent displays market forecasts 2010 2020

3.6. Other display technologies

3.6.1. Thermochromic

3.6.2. Electrowetting displays

3.6.3. Liquavista, The Netherlands

3.6.4. ITRI, Taiwan and PVI, Taiwan

3.6.5. Electrochemical displays on paper

3.6.6. Flexible LCDs

3.6.7. Kent Displays

3.6.8. Other displays market size 2010-2020
4. LIGHTING

4.1. Significance of lighting and challenges

4.2. Comparisons of lighting technologies

4.3. General illumination market

4.4. Lighting forecasts 2010-2020

4.5. Value Chain and examples of OLED lighting

4.6. AC electroluminescent lighting

4.7. LEDs
5. POWER: PHOTOVOLTAICS AND BATTERIES

5.1. Photovoltaics

5.1.1. Thin film Photovoltaics

5.1.2. Comparison of technologies

5.1.3. Solar cell production by company

5.1.4. Trends by territory

5.1.5. Parameters for comparing Photovoltaic technologies

5.2. Photovoltaics Forecasts

5.2.1. Forecast analysis

5.2.2. Photovoltaic subsidies - should more be given?

5.2.3. The need for storage

5.2.4. Installation of photovoltaics

5.2.5. Hope for silicon photovoltaics to reach grid price parity

5.2.6. Strategies of market entry for new, potentially cheaper technologies

5.2.7. Photovoltaics in 2009/2010 after the mid 2008 peak

5.3. Batteries

5.3.1. Importance of laminar batteries

5.3.2. Button batteries vs laminar batteries

5.3.3. Choices of laminar battery

5.3.4. Applications of laminar batteries

5.3.5. Infinite Power Solutions

5.3.6. Solicore, USA

5.3.7. Power Paper

5.3.8. Blue Spark

5.3.9. VoltaFlex

5.3.10. Enfucell

5.4. Printed batteries forecasts 2010-2020

5.4.2. Laminar batteries - missing the big opportunity?

5.5. Fuel cells
6. SENSORS AND OTHER ELECTRONIC COMPONENTS

6.1. General situation and examples

6.2. Photodetector arrays

6.2.1. Printed flexible scanners

6.3. Touch screens

6.4. Successes and failures

6.5. Sensor Forecasts 2010-2020
7. MARKET BY TERRITORY, COMPONENTS, MATERIALS, OPPORTUNITIES

7.1. Market by territory

7.1.1. Number of active organisations globally in this field

7.1.2. Geographical split 2010-2020

7.1.3. Giant corporations of the world and their progress with printed electronics

7.2. The total market opportunity by component

7.3. Organic versus Inorganic

7.4. Printed versus non printed electronics

7.5. Flexible/conformal versus rigid electronics

7.6. Market forecasts for materials 2010-2020

7.7. Impact of printed electronics on conventional markets

7.7.2. Impact on end-use markets

7.7.3. Potential markets

7.8. Printed electronics: fundraising, investors, list of companies

7.8.1. Printed Electronics Commercial Fund Raising Activities

7.8.2. Printed Electronics Government Funded Activities
8. UNMET NEEDS, OPPORTUNITIES AND PROGRESS

8.1. Statistics for materials running out

8.1.1. Indium

8.1.2. Rare Earths

8.1.3. Escape Routes

8.1.4. Selenium

8.1.5. Quantum dots, carbon nanotubes, common compounds

8.1.6. Material supply and sustainability of thin film CIGS and CdTe Photovoltaics

8.2. Low temperature processes/curing

8.2.1. New ink formulations

8.2.2. Breakthrough in metal ink cure from Novacentrix: room temperature on cheap substrates

8.2.3. New Copper ink

8.3. Backplane transistor arrays hold up AMOLED market penetration

8.4. Need for better flexible, transparent, low cost barriers

8.5. Lack of standardised benchmarking

8.6. Urgent need for creative product design
9. COMPANY PROFILES

9.1.1. ACREO

9.1.2. Asahi Kasei

9.1.3. Asahi Glass

9.1.4. BASF

9.1.5. DaiNippon Printing

9.1.6. Evonik

9.1.7. Fujifilm Dimatix

9.1.8. G24i

9.1.9. HC Starck

9.1.10. Hewlett Packard

9.1.11. Holst Centre

9.1.12. InkTec

9.1.13. ITRI Taiwan

9.1.14. Konarka

9.1.15. Kovio Inc

9.1.16. Merck Chemicals

9.1.17. National Information Society Agency

9.1.18. Optomec

9.1.19. Organic ID

9.1.20. Philips

9.1.21. Plastic E Print

9.1.22. Plastic Logic

9.1.23. Plextronics

9.1.24. PolyIC

9.1.25. PVI

9.1.26. Samsung

9.1.27. Semiconductor Energy Laboratory

9.1.28. Seiko Epson

9.1.29. Soligie

9.1.30. Thin Film Electronics

9.1.31. Toppan Forms

9.1.32. Toppan Printing

9.1.33. University of Tokyo

9.1.34. Waseda University

9.1.35. Other players in this value chain
APPENDIX 1: MATRIX OF PRINTED ELECTRONICS SUPPLIERS AND ACTIVITIES

APPENDIX 2: IDTECHEX PUBLICATIONS AND CONSULTANCY


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